HC49US-JG0318-20.000 查看數據表（PDF） - ILSI America LLC
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HC49US-JG0318-20.000 Datasheet PDF : 2 Pages
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2 Lead Metal Package Quartz Crystal, 4.7 mm x 11 mm
Pb Free Solder Reflow Profile:
HC49US Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
Marking
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Line 1 ILSI, Frequency, Date Code (yww)
06/09_A
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
Specifications subject to change without notice
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