HCPL-270L-500 查看數據表（PDF） - HP => Agilent Technologies

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HCPL-270L-500

Low Input Current High Gain LVTTL/LVCMOS Compatible 3.3 V Optocouplers

HP => Agilent Technologies 

The HCPL-070L and HCPL-073L

are surface mount devices

packaged in an industry standard

SOIC-8 footprint.

The SOIC-8 does not require

"through holes" in a PCB. This

package occupies approximately

one-third the footprint area of the

standard dual-in-line package.

The lead profile is designed to be

compatible with standard surface

mount processes.

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-270L #XXX

060 = VDE 0884 VIORM = 630 Vpeak Option

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Agilent sales representative

or authorized distributor for information.

Selection Guide

8-Pin DIP (300 Mil)

Single Channel

Package HCPL-

Dual Channel

Package HCPL-

270L

273L

Small Outline SO-8

Single Channel

Package HCPL-

Dual Channel

Package HCPL-

070L

073L

Minimum Input

ON Current (IF)

0.5 mA

1.6 mA

Minimum CTR

400%

300%

Schematic

2 IF

ANODE

+

VF

–

CATHODE

3

SHIELD

HCPL-270L/HCPL-070L

VCC

8

ICC

IB

7

VB

1 IF1

+

VF1

–

2

ICC

VCC

8

IO1

VO1

7

IO 6

VO

5

GND

3 IF2

–

VF2

+

4

IO2

VO2

6

SHIELD

GND

5

USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED

BETWEEN PINS 5 AND 8 IS RECOMMENDED

HCPL-273L/HCPL-073L

2

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