HCPL-0723-300 查看數據表（PDF） - HP => Agilent Technologies

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HCPL-0723-300

50 MBd 2 ns PWD High Speed CMOS Optocoupler

HP => Agilent Technologies 

Agilent HCPL-7723 & HCPL-0723

50 MBd 2 ns PWD

High Speed CMOS Optocoupler

Data Sheet

Description

Available in either 8-pin DIP or

SO-8 package style respectively, the

HCPL-7723 or HCPL-0723

optocoupler utilize the latest CMOS

IC technology to achieve out-

standing speed performance of

minimum 50 MBd data rate and

2 ns maximum pulse width

distortion.

Basic building blocks of HCPL-

7723/0723 are a CMOS LED

driver IC, a high speed LED and a

CMOS detector IC. A CMOS logic

input signal controls the LED

driver IC, which supplies current

to the LED. The detector IC

incorporates an integrated

photodiode, a high speed

transimpedance amplifier, and a

voltage comparator with an

output driver.

Functional Diagram

**VDD1 1

8 VDD2**

VI 2

*3

GND1 4

LED1

SHIELD

7 NC*

IO

6 VO

5 GND2

* PIN 3 IS THE ANODE OF THE INTERNAL LED AND MUST BE LEFT

UNCONNECTED FOR GUARANTEED DATASHEET PERFORMANCE.

PIN 7 IS NOT CONNECTED INTERNALLY.

** A 0.1 µF BYPASS CAPACITOR MUST BE CONNECTED BETWEEN

PINS 1 AND 4, AND 5 AND 8.

TRUTH TABLE

(POSITIVE LOGIC)

VI, INPUT

H

L

LED1

OFF

ON

VO, OUTPUT

H

L

Features

• +5 V CMOS compatibility

• High speed: 50 MBd min.

• 2 ns max. pulse width distortion

• 22 ns max. prop. delay

• 16 ns max. prop. delay skew

• 10 kV/µs min. common mode

rejection

• –40 to 85°C temperature range

• Safety and regulatory approvals

(Pending)

UL recognized

– 3750 V rms for 1 min. per UL1577

CSA component acceptance

notice #5

IEC/EN/DIN EN 60747-5-2

– Viorm = 630 Vpeak for HCPL-7723

option 060

– Viorm = 560 Vpeak for HCPL-0723

option 060

Applications

• Digital fieldbus isolation: CC-Link,

DeviceNet, Profibus, SDS

Isolated A/D or D/A conversion

• Multiplexed data transmission

• High Speed Digital Input/Output

•

• Computer peripheral interface

• Microprocessor system interface

CAUTION: It is advised that normal static precautions be taken in handling and assembly of

this component to prevent damage and/or degradation, which may be induced by ESD.

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