HCPL-0723-500 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-0723-500 Datasheet PDF : 12 Pages
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
tp
Tp
TL 217 °C
260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
Tsmax 150 - 200 °C
Tsmin
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
Regulatory Information
The HCPL-7723/0723 have been
approved by the following
organizations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997+A1:2002/
EN 60747-5-2:2001+A1:2002/
DIN EN 60747-5-2 (VDE 0884
Teil 2): 2003-01.
(Option 060 only)
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
Insulation and Safety Related Specifications
Value
Parameter
Symbol 7723 0723
Minimum External Air Gap
(Clearance)
L(I01) 7.1 4.9
Minimum External Tracking
(Creepage)
L(I02) 7.4 4.8
Minimum Internal Plastic Gap
(Internal Clearance)
0.08 0.08
Units
mm
mm
mm
Tracking Resistance
CTI
(Comparative Tracking Index)
Isolation Group
≥ 175 ≥ 175 Volts
IIIa IIIa
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
5
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