HCPL-0738-060 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-0738-060 Datasheet PDF : 8 Pages
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Selection Guide
Small Outline SO-8
HCPL-0738
Ordering Information
Specify Part Number followed by
Option Number (if desired).
Example
HCPL-0738 -060 = VDE0884
Option
HCPL-0738 -500 = Tape and
Reel Packaging Option
No Option Code contains 100
units per tube. Option 500
contains 1500 units per reel.
Option data sheets available.
Contact Agilent Technologies
sales representative or authorized
distributor.
Package Outline Drawing
HCPL-0738 Outline Drawing (Small Outline SO-8 Package)
8
3.937 ± 0.127
(0.155 ± 0.005)
PIN 1
ONE
0.405 ± 0.076
(0.015 ± 0.003)
765
XXX
YWW
234
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1.270
(0.050)
BSG
*5.080 ± 0.127
(0.205 ± 0.005)
7°
45° x(00..403127)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 - 7°
*TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.228 ± 0.025
(0.009 ± 0.001)
0.202 ± 0.102
(0.008 ± 0.004)
0.305
(0.012)
MIN.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
2
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