HCPL-0738 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-0738 Datasheet PDF : 8 Pages
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Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
TUV
Approved according to
VDE 0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications (approval pending)
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(I01)
L(I02)
CTI
Value
4.9
4.8
0.08
≥ 175
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector; also
known as distance through insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when deter-
mining the circuit insulation re-
quirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For creep-
age, the shortest distance path
along the surface of a printed
circuit board between the solder
fillets of the input and output
leads must be considered. There
are recommended techniques
such as grooves and ribs which
may be used on a printed circuit
board to achieve desired creep-
age and clearances. Creepage and
clearance distances will also
change depending on factors
such as pollution degree and
insulation level.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Output Voltage
Average Forward Input Current
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Minimum
Maximum
TS
–55
125
TA
–40
100
VDD
0
6.0
VO
–0.5
VDD + 0.5
IF
—
20
IO
—
2
260˚C for 10 seconds, 1.6 mm below seating plane
See Solder Reflow Thermal Profile section
Units
˚C
˚C
Volts
Volts
mA
mA
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
Symbol
TA
VDD
IF
3
Minimum
–40
4.5
10
Maximum
100
5.5
16
Units
˚C
V
mA
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