HCPL-2400-300 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-2400-300 Datasheet PDF : 14 Pages
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Solder Reflow Temperature Profile
(Gull Wing Surface Mount Option 300 Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
78
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-24XX has been
approved by the following
organizations:
VDE
Approved according to VDE
0884/06.92 (Option 060 only).
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Symbol
L(101)
L(102)
Tracking Resistance
CTI
(Comparative
Tracking Index)
Isolation Group
Value
7.1
7.4
0.08
200
IIIa
Units
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
mm Measured from input terminals to output
terminals, shortest distance path along body.
mm
Volts
Through insulation distance, conductor to
conductor, usually the direct distance between the
photoemitter and photodetector inside the
optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
1-303
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