HCPL-063L-500 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-063L-500 Datasheet PDF : 14 Pages
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Small Outline SO-8 Package
8
3.937 ± 0.127
(0.155 ± 0.005)
PIN ONE 1
0.406 ± 0.076
(0.016 ± 0.003)
765
XXX
YWW
234
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1.270 BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
45°
X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile
(Surface Mount Option Parts)
260
240
220
200
∆T = 115°C, 0.3°C/SEC
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
01
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.
Regulatory Information
The HCPL-260L/060L/263L/063L
are pending by the following
organizations:
UL
Approval (pending) under UL
1577, Component Recognition
Program, File E55361.
CSA
Approval (pending) under CSA
Component Acceptance Notice
#5, File CA 88324.
VDE
Approval (pending) according to
VDE 0884/06.92.
6 − 107
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