HCPL-260L-060 查看數據表（PDF） - Avago Technologies
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HCPL-260L-060 Datasheet PDF : 20 Pages
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
TEMP.
245°C
200
160 C
150 C
140 C
100
2.5 C ± 0.5 C/SEC.
3 C + 1 C/–0.5 C
PREHEATING TIME
150 C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended PB-Free IR Profile
tp
Tp
TL 217 C
260 +0/-5 C
RAMP-UP
3 C/SEC. MAX.
Tsmax 150 - 200 C
Tsmin
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 C/SEC. MAX.
60 to 150 SEC.
25
t 25 C to PEAK
TIME
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 C, Tsmin = 150 C
Note: Non-halide flux should be used.
5
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