5962-8876901XA-100 查看數據表（PDF） - HP => Agilent Technologies

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5962-8876901XA-100

Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers

HP => Agilent Technologies 

4

Leaded Device Marking

Leadless Device Marking

Agilent LOGO

Agilent P/N

DSCC SMD*

DSCC SMD*

PIN ONE/

ESD IDENT

A QYYWWZ

XXXXXX

XXXXXXX

XXX XXX

50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

COUNTRY OF MFR.

Agilent FSCN*

*QUALIFIED PARTS ONLY

Agilent LOGO

Agilent P/N

PIN ONE/

ESD IDENT

COUNTRY OF MFR.

A QYYWWZ

XXXXXX

XXXX

XXXXXX

XXX 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

DSCC SMD*

DSCC SMD*

Agilent FSCN*

*QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

100

Description

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details).

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.14 (0.045)

1.40 (0.055)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

200 Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead

finish. All leadless chip carrier devices are delivered with solder dipped terminals as a

standard feature.

300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details). This option has solder dipped leads.

4.57 (0.180)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

0.51 (0.020)

MAX.

5° MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

9.65 (0.380)

9.91 (0.390)

4.57 (0.180)

MAX.

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