HCPL-7520-000E 查看數據表（PDF） - Avago Technologies

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HCPL-7520-000E

Isolated Linear Sensing IC

Avago Technologies 

Solder Reflow Temperature Profile

300

PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.

REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.

PEAK

TEMP.

245˚C

200

160˚C

150˚C

140˚C

100

2.5˚C ± 0.5˚C/SEC.

3˚C + 1˚C/–0.5˚C

PREHEATING TIME

150˚C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240˚C

SOLDERING

TIME

200˚C

PEAK

TEMP.

230˚C

50 SEC.

TIGHT

TYPICAL

LOOSE

0

0

50

100

150

200

250

ROOM TEMPERATURE

TIME (SECONDS)

Note: Use of non-chlorine-activated fluxes is highly recommended.

Recommended Pb-Free IR Profile

tp

Tp

TL

Tsmax

Tsmin

260 +0/-5 ˚C

217 ˚C

RAMP-UP

3 ˚C/SEC. MAX.

150 - 200 ˚C

ts

PREHEAT

tL

60 to 180 SEC.

TIME WITHIN 5 ˚C of ACTUAL

PEAK TEMPERATURE

20-40 SEC.

RAMP-DOWN

6 ˚C/SEC. MAX.

60 to 150 SEC.

25

t 25 ˚C to PEAK

TIME (SECONDS)

NOTES:

THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 ˚C, Tsmin = 150 ˚C

Note: Use of non-chlorine-activated fluxes is highly recommended.



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