HCPL-817 查看數據表（PDF） - Avago Technologies

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HCPL-817

Phototransistor Optocoupler High Density Mounting Type

Avago Technologies 

HCPL-817-300E

4.6 ± 0.5

(0.181)

7.62 ± 0.3

(0.3)

LEAD FREE

ANODE

A 817

Y WW

DATE CODE

6.5 ± 0.5

(0.256)

1.2 ± 0.1

(0.047)

RANK

3.5 ± 0.5

(0.138)

2.54 ± 0.25

(0.1)

0.35 ± 0.25

(0.014)

1.0 ± 0.25

(0.039)

10.16 ± 0.3

(0.4)

0.26

(0.010)

DIMENSIONS IN MILLIMETERS AND (INCHES)

Solder Reflow Temperature Profile

250°C

217°C

200°C

30 seconds

260°C (Peak Temperature)

150°C

60 sec

25°C

60 ~ 150 sec

Note: Non-halide flux should be used.

90 sec

Time (sec)

60 sec

1) One-time soldering reflow is recommended

within the condition of temperature and time

profile shown.

2) When using another soldering method such

as infrared ray lamp, the temperature may

rise partially in the mold of thedevice. Keep

the temperature on the package of the device

within the condition of (1) above.

Absolute Maximum Ratings (TA = 25˚C)

Storage Temperature, TS

Operating Temperature, TA

Lead Solder Temperature, max.

(1.6 mm below seating plane)

Average Forward Current, IF

Reverse Input Voltage, VR

Input Power Dissipation, PI

Collector Current, IC

Collector-Emitter Voltage, VCEO

Emitter-Collector Voltage, VECO

Collector Power Dissipation

Total Power Dissipation

Isolation Voltage, Viso (AC for 1 minute, R.H. = 40 ~ 60%)

–55˚C to +125˚C

–30˚C to +100˚C

260˚C for 10 s

50 mA

6V

70 mW

50 mA

70 V

6V

150 mW

200 mW

5000 Vrms



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