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HDSP-2179 查看數據表(PDF) - HP => Agilent Technologies

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HDSP-2179 Datasheet PDF : 16 Pages
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2
Package Dimensions
HDSP-213X/2179
Note:
1. All dimensions are in mm (inches).
2. Unless otherwse specified tolerance is ±0.30 mm (±0.015).
3. For green and yellow devices only.
4. Leads are copper alloy, solder dipped.
PIN
PIN
NO. FUNCTION NO.
FUNCTION
1 CLS
2 CLK
3 WR
4 CE
5 RST
6 RD
7 NO PIN
8 NO PIN
9 NO PIN
10 NO PIN
11 D0
12 D1
13 D2
14 D3
15 NC
16 VDD
17 GND (SUPPLY)
18 GND (LOGIC)
19 D4
20 D5
21 D6
22 D7
23 NO PIN
24 NO PIN
25 NO PIN
26 NO PIN
27 FL
28 A0
29 A1
30 A2
31 A3
32 A4
Absolute Maximum Ratings
Supply Voltage, VDD to Ground[1] ........................................ -0.3 to 7.0 V
Operating Voltage, VDD to Ground[2] ............................................. 5.5 V
Input Voltage, Any Pin to Ground .............................. -0.3 to VDD +0.3 V
Free Air Operating Temperature Range, TA .................... -55°C to +85°C
Storage Temperature, TS .............................................. -55°C to +100°C
CMOS IC Junction Temperature, TJ (IC) .................................... +150°C
Wave Solder Temperature,
1.59 mm (0.063 in.) below Body ............................... 250°C for 3 secs
ESD Protection @ 1.5 k, 100 pF ......................... VZ = 4 kV (each pin)
Notes:
1. Maximum voltage is with no LEDs illuminated.
2. 20 dots ON in all locations at full brightness.
ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH
THE HDSP-2131, HDSP-2132, HDSP-2133, AND HDSP-2179.

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