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HDSP-S51E-EE000 查看數據表(PDF) - HP => Agilent Technologies

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HDSP-S51E-EE000 Datasheet PDF : 12 Pages
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Absolute Maximum Ratings at TA = 25˚C
Parameter
Average Power per Dot[1]
Peak Forward Current per Dot[1]
(1/8 Duty Cycle at 10 KHz)
Average Forward Current per Dot
GaP Red
HDSP-S51E/S56E/B51Z/B56Z
65
GaP Green
HDSP-S51G/S56G/B51Z/B56Z
65
Units
mW
80
100
mA
25[1,2]
25[1,3]
mA
Reverse Voltage per Dot
3
3
V
Operating Temperature
–35 to +85
–35 to +85
°C
Storage Temperature
–35 to +85
–35 to +85
°C
Lead Solder Temperature for 3 seconds[4]
(2 mm [0.078 in.] below seating plane)
260
260
°C
Notes:
1. Do not exceed maximum average current per dot.
2. Derate above 25°C at 0.20 mA/°C.
3. Derate above 25°C at 0.33 mA/°C.
4. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not to exceed 3 seconds.
8

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