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HEF40175B 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
生产厂家
HEF40175B
NXP
NXP Semiconductors. NXP
HEF40175B Datasheet PDF : 15 Pages
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NXP Semiconductors
SO16: plastic small outline package; 16 leads; body width 3.9 mm
HEF40175B
Quad D-type flip-flop
SOT109-1
D
y
Z
16
pin 1 index
1
e
E
A
X
c
HE
vM A
9
A2
A1
8
bp
wM
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.020
0.01
0.01
0.004
0.028
0.012
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT109-1
IEC
076E07
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT109-1 (SO16)
HEF40175B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 14 December 2010
© NXP B.V. 2010. All rights reserved.
10 of 15

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