HGT1S3N60C3DS9A 查看數據表（PDF） - Harris Semiconductor
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HGT1S3N60C3DS9A
Harris Semiconductor
HGT1S3N60C3DS9A Datasheet PDF : 11 Pages
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HGTP3N60C3D, HGT1S3N60C3D, HGT1S3N60C3DS
TO-263AB
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
E
H1
D
L
1
3
b
e
e1
TERM. 4
L2
b1
A
A1
TERM. 4
L1
c
J1
.450
(11.43)
L3
b2
.700
(17.78)
.350
(8.89)
3
1
.150
(3.81)
.080(2.03)
.080(2.03)
.062(1.58)
.062(1.58)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
LEAD 1
LEAD 3
TERM. 4
- GATE
- EMITTER
- COLLECTOR
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
4, 5
b
0.030
0.034
0.77
0.86
4, 5
b1
0.045
0.055
1.15
1.39
4, 5
b2
0.310
-
7.88
-
2
c
0.018
0.022
0.46
0.55
4, 5
D
0.405
0.425 10.29
10.79
-
E
0.395
0.405 10.04
10.28
-
e
0.100 TYP
2.54 TYP
7
e1
0.200 BSC
5.08 BSC
7
H1
0.045
0.055
1.15
1.39
-
J1
0.095
0.105
2.42
2.66
-
L
0.175
0.195
4.45
4.95
-
L1
0.090
0.110
2.29
2.79
4, 6
L2
0.050
0.070
1.27
1.77
3
L3
0.315
-
8.01
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-263AB outline dated 2-92.
2. L3 and b2 dimensions established a minimum mounting surface
for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L1 is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 7 dated 10-95.
10
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