HI-8382, HI-8383
HI-8382 PACKAGE THERMAL CHARACTERISTICS
PACKAGE STYLE 1
28 Lead PLCC
16 Lead Ceramic SB DIP
MAXIMUM ARINC LOAD 7
ARINC 429
DATA RATE
Low Speed 3
High Speed 4
SUPPLY CURRENT (mA)2
Ta = 25°C Ta = 85°C Ta = 125°C
17.6
17.2
17.0
25.4
24.5
24.2
Low Speed
17.9
17.4
17.1
High Speed
25.8
24.8
24.4
J U N C T I O N T E M P, T j ( ° C )
Ta = 25°C Ta = 85°C Ta = 125°C
48
107
142
56
11 0
150
41
103
145
47
11 2
147
PACKAGE STYLE 1
28 Lead PLCC
16 Lead Ceramic SB DIP
AOUT and BOUT Shorted To Ground 5, 6, 7
ARINC 429
SUPPLY CURRENT (mA)2
J U N C T I O N T E M P, T j ( ° C )
DATA RATE
Low Speed 3
High Speed 4
Ta = 25°C
60.1
63.1
Ta = 85°C
55.7
56.3
Ta = 125°C
52.4
52.3
Ta = 25°C
11 0
100
Ta = 85°C
157
150
Ta = 125°C
194
182
Low Speed
62.1
56.2
53.0
90
145
180
High Speed
64.0
56.2
52.2
86
144
176
Notes:
1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. Similar results would be obtained with AOUT shorted to BOUT.
6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
7. Data will vary depending on air flow and the method of heat sinking employed.
ORDERING INFORMATION
HI - 838x x x - xx (Ceramic)
PART
NUMBER
Blank
T
M-01
M-03
TEMPERATURE
RANGE
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
FLOW
I
T
M
DSCC
BURN
IN
No
No
Yes
Yes
NOTES
(1)
(1) & (2)
PART
NUMBER
C
S
U
PACKAGE
DESCRIPTION
LEAD
FINISH
NOTES
16 PIN CERAMIC SIDE BRAZED DIP (16C)
Gold
(3) & (1)
28 PIN CERAMIC LEADLESS CHIP CARRIER (28S)
Gold
(3) & (1)
32 PIN CERQUAD (32U) not available with ‘M’ flow Tin/Lead Solder
PART
NUMBER
OUTPUT SERIES
RESISTANCE FUSE
8382
37.5 Ohms
Yes
8383
13 Ohms
No
(1) Process Flows M and DSCC always have Tin/Lead (Sn/Pb) solder lead finish.
(2) DSCC SMD# 5962-8687901EA. Only available in “C” package with Sn/Pb solder lead finish.
(3) Gold terminal finish is Pb-Free, RoHS compliant.
HOLT INTEGRATED CIRCUITS
5