5962-8687901EA 查看數據表（PDF） - Holt Integrated Circuits
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5962-8687901EA Datasheet PDF : 9 Pages
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HI-8382 PACKAGE DIMENSIONS
16-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 16C
.810
(20.574)
max
.125 min
(3.175)
PIN 1
.200
(5.080)
max
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.018 ± .002
(.457 ±.051)
.295 ±.010
(7.493 ±.254)
.050 ±.005
(1.270 ±.127)
.035 ± .010
(.889 ±.254)
BASE
PLANE
SEATING
PLANE
.100
(2.54) BSC
.010 ±.002
(.254 ±.051)
.300 ± .010
(7.620 ±.254)
28-PIN PLASTIC PLCC
PIN NO. 1
.045 x 45°
PIN NO. 1 IDENT
.045 x 45°
inches (millimeters)
Package Type: 28J
.050
(1.27)
BSC
.490 ± .005
(12.446 ±.127)
SQ.
.453 ± .003
(11.506 ±.076)
SQ.
.031 ±.005
(.787 ±.127)
See Detail A
.173 ±.008
(4.394 ±.203)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.410 ±.020
(10.414 ±.508)
.017 ±.004
(.432 ±.102)
.010 ± .001
(.254 ± .03)
.020
(.508)
min
DETAIL A
R .035
.889
HOLT INTEGRATED CIRCUITS
8
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