HLMP-3750 查看數據表（PDF） - HP => Agilent Technologies
零件编号
产品描述 (功能)
生产厂家
HLMP-3750 Datasheet PDF : 10 Pages
| |||
4
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1,B1: Right Angle Housing, Uneven Leads
A2,B2: Right Angle Housing, Even Leads
Dx, Ex: Ammo Pack, Straight Leads
FH: 2 Iv bin select with Inventory Control
Vx: Ammo Pack, Crimped Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2&3 only
N: Color bin 6&7 only
Maximum Iv Bin Options
0: Open (No. max. limit)
Others: Please refer to the Iv bin table
Minimum Iv Bin Options
Please refer to the Iv bin table
Color Options
3,7: GaP HER
4,8: GaP Yellow (except K4xx series)
5,9: GaP Green
6: GaP Emerald Green
Package Option
1,K: T-1 (3 mm)
3,D: T-13/4 (5 mm)
Absolute Maximum Ratings at TA = 25°C
Parameter
Red
Yellow
Green/Emerald Green
Peak Forward Current
90
60
90
Average Forward Current[1]
25
20
25
DC Current[2]
30
20
30
Transient Forward Current[3]
500
500
500
(10 µs Pulse)
Reverse Voltage (IR = 100 µA)
5
5
5
LED Junction Temperature
110
110
110
Operating Temperature Range
-55 to +100 -55 to +100
-20 to +100
Storage Temperature Range
-55 to +100
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
260°C for 5 seconds
Units
mA
mA
mA
mA
V
°C
°C
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and
wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Share Link: 