HLMP-C115 查看數據表（PDF） - HP => Agilent Technologies
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HLMP-C115 Datasheet PDF : 6 Pages
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2
Package Dimensions
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20 (NOTE 1)
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
(311.2.6404) MIN.
CATHODE
LEAD
1.85 (0.073)
0.70 (0.028)
MAX.
MAX.
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. AN EPOXY MENISCUS MAY EXTEND ABOUT
0.5 mm (0.020 in.) DOWN THE LEADS.
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current[1]
Transient Forward Current[2]
(10 µsec Pulse)
Reverse Voltage (Ir = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
TS
AlGaAs
Red
50
500
DH AS
AlGaAs
Red
30
500
High
Efficiency
Red and
Orange
30
500
Yellow
20
500
5
5
5
5
110
110
110
110
-55 to +100 -20 to +100
-55 to +100
-55 to +100
260 °C for 5 seconds
High
Performance
Green and
Emerald
Green
30
500
Units
mA
mA
5
V
110
°C
-20 to +100
°C
°C
Notes:
1. See Figure 5 for maximum current derating vs. ambient temperature.
2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire
bond.
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