HLMP-HB61 查看數據表（PDF） - Avago Technologies
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HLMP-HB61 Datasheet PDF : 12 Pages
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TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
200
150
FLUXING
100
50
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER
96.5%Sn; 3.0%Ag; 0.5% Cu
30
PREHEAT
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
0
10
20
30
40
50
60
70
80
90
100
TIME - SECONDS
10
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