HLMP-DB25-G00DD 查看數據表（PDF） - HP => Agilent Technologies
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HLMP-DB25-G00DD Datasheet PDF : 6 Pages
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2
Selection Guide
Part Number
HLMP-KB45-A00xx
HLMP-DB25-B00xx
Package
T-1
T-1 3/4
Viewing Angle
40
25
Luminous Intensity Iv (mcd)
Min.
Max.
30
–
40
–
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
02: Tape & Reel, Straight Leads
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle
25: 25 degrees
45: 40 degrees
Color Options
B: Blue 462 nm
Package Options
D: T-1 3/4 (5 mm)
K: T-1 (3 mm)
Absolute Maximum Ratings at TA = 25˚C
Parameter
Blue
Units
Peak Forward Current
70
mA
DC Current[1]
30
mA
Reverse Voltage (IR = 100 µA)
5
V
Transient Forward Current[2]
350
mA
(10 µsec Pulse)
LED Junction Temperature
115
˚C
Operating Temperature
–20 to +80
˚C
Storage Temperature
–30 to +100
˚C
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
260°C for 5 seconds
Notes:
1. Derate linearly from 50 °C as shown in Figure 6.
2. The transient peak current is the maximum non-recurring peak current that can be
applied to the device without damaging the LED die and wirebond. It is not
recommended that this device be operated at peak currents above the Absolute
Maximum Peak Forward Current.
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