HMC322 查看數據表（PDF） - Hittite Microwave

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HMC322

GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz

Hittite Microwave 

Outline Drawing

v00.0303

HMC322

GaAs MMIC SP8T NON-REFLECTIVE

SWITCH, DC - 10.0 GHz

4

Die Packaging Information [1]

Standard

Alternate

WP-3

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. DIMENSIONS IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS 0.004”.

3. TYPICAL BOND PAD IS 0.004” SQUARE.

4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. NO CONNECTION REQUIRED FOR UNLABELED GROUND BOND PADS.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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