HMC326MS8 查看數據表（PDF） - Hittite Microwave

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HMC326MS8

GaAs InGaP HBT MMIC DRIVERAMPLIFIER, 3.0 - 4.5 GHz

Hittite Microwave 

Evaluation PCB

9

v08.0808

HMC326MS8G / 326MS8GE

GaAs InGaP HBT MMIC DRIVER

AMPLIFIER, 3.0 - 4.5 GHz

List of Materials for Evaluation PCB 104356 [1]

Item

J1 - J2

J3

C1 - C2

C3

C4

C5

L1

U1

Description

PCB Mount SMA RF Connector

2mm DC Header

330 pF Capacitor, 0603 Pkg.

0.7 pF Capacitor, 0603 Pkg.

3.0 pF Capacitor, 0402 Pkg.

2.2 μF Capacitor, Tantalum

3.3 nH Inductor, 0805 Pkg.

HMC326MS8G / HMC326MS8GE

Amplifier

The circuit board used in the final application should

use RF circuit design techniques. Signal lines

should have 50 ohm impedance while the package

ground leads and exposed paddle should be con-

nected directly to the ground plane similar to that

shown. A sufficient number of via holes should be

used to connect the top and bottom ground planes.

The evaluation board should be mounted to an

appropriate heat sink. The evaluation circuit board

shown is available from Hittite upon request.

PCB [2]

104106 Eval Board

[1] Reference this number when ordering complete evaluation PCB

[2] Circuit Board Material: Rogers 4350, 10 mil thick, tr = 3.48

9 - 36

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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