HMMC-5023 查看數據表（PDF） - HP => Agilent Technologies
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HMMC-5023 Datasheet PDF : 6 Pages
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HMMC-5023 Typical Performance
30 VD1 = VD2 = 5.0 V
26
0.02 dB/°C[1]
typical
22
Spec Range
18
21.2 – 23.6 GHz
–55°C
–30°C
0° C
+30°C
+60°C
+100°C
5 VD1 = VD2 = 5.0 V, TA = 25°C [3]
4
Spec Range
21.2 – 23.6 GHz
3
2
14
1
10
19.0 20.2 21.4 22.6 23.8 25.0
FREQUENCY (GHz)
Figure 4. Small-Signal Gain vs.
Frequency and Ambient Temperature[1].
0
19.0 20.2 21.4 22.6 23.8 25.0
FREQUENCY (GHz)
Figure 5. Noise Figure vs. Frequency[2].
20 VD1 = VD2 = 5.0 V
20
21 GHz
25
23 GHz
15
Gain
20
10
0 VD1 = VD2 = 5.0 V, fO = 22 GHz
30
–15
25
Gain
–30
20
15
5
ηadded
10
0
2
4
6
8
10
12
OUTPUT POWER (dBm)
Figure 6. Gain Compression and
Efficiency Characteristics[2].
–45
15
2nd Harmonic
–60
2
10
4
6
8
10
12
OUTPUT POWER (dBm)
Figure 7. Second Harmonic and Gain
Compression Characteristics[2].
Notes:
1. Device tested while mounted on a HP83040 Modular Microcircuit Fixture calibrated at the coaxial
connectors. Test results shown have been degraded by the fixture due to loss and impedance mismatch
errors. The temperature coefficient of the fixture alone is approximately 0.003 dB/°C at 20 GHz.
2. Data obtained from wafer-probed measurements.
3. The temperature coefficient of noise figure was measured for one device mounted on a HP83040 Modular
Microcircuit Fixture. The uncorrected result, <0.014 dB/°C, includes the effects of the fixture.
600
520
RF INPUT
300
RF OUTPUT
300
80
0
0
435
755
1235
1555
Figure 8. HMMC-5023 Bonding Pad Locations. (Dimensions are in micrometers)
6-38
105 (VG2 Y-axis)
0
1880
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