HS-1840RH_883S 查看數據表（PDF） - Intersil

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HS-1840RH_883S

Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection

Intersil 

HS-1840RH/883S

Metallization Topology

DIE DIMENSIONS:

110 x 159 x 11mils

METALLIZATION:

Type: Al

Thickness: 12.5kÅ ± 2kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ± 1kÅ

DIE ATTACH:

Material: Gold Eutectic

Temperature: Sidebrazed Ceramic DIP - 460oC (Max)

Flatpack - 460oC (Max)

WORST CASE CURRENT DENSITY: 1.90e04A/cm2

LEAD TEMPERATURE (10 Seconds Soldering): <275oC

PROCESS: CMOS-DI

Metallization Mask Layout

HS-1840RH/883S

IN8

-V

OUT

+V

IN16

11

ENABLE

A0

A1

A2

A3

VREF

GND

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