5962F9666301QEC 查看數據表（PDF） - Intersil
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5962F9666301QEC Datasheet PDF : 3 Pages
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HS-26C31RH, HS-26C31EH
Die Characteristics
DIE DIMENSIONS:
96.5 mils x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10kÅ ±1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800Å
M2: Al/Si/Cu (Top)
Thickness: 10kÅ ±1kÅ
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0x105A/cm2
Bond Pad Size:
110µmx100µm
Metallization Mask Layout
HS-26C31RH, HS-26C31EH
AO (2)
AO (3)
ENABLE (4)
BO (5)
BO (6)
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
3
FN3401.6
January 8, 2013
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