HSDL-3210 查看數據表（PDF） - HP => Agilent Technologies

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HSDL-3210

IrDA® Compliant Low Power 1.15 Mbit/s Infrared Transceiver

HP => Agilent Technologies 

Reflow Profile

230

200

183

170

150

R2

125

100

R1

MAX. 245°C

R3

R4

90 sec.

MAX.

ABOVE

183°C

R5

50

25

0

50

100

150

200

250

300

P1

HEAT

UP

t-TIME (SECONDS)

P2

SOLDER PASTE DRY

P3

SOLDER

REFLOW

P4

COOL

DOWN

Figure 12. Reflow graph.

Process Zone

Heat Up

Solder Paste Dry

Solder Reflow

Cool Down

Symbol

P1, R1

P2, R2

P3, R3

P3, R4

P4, R5

∆T

25˚C to 125˚C

125˚C to 170˚C

170˚C to 230˚C (245˚C at 10 seconds max.)

230˚C to 170˚C

170˚C to 25˚C

Maximum ∆T/∆time

4˚C/s

0.5˚C/s

4˚C/s

–4˚C/s

–3˚C/s

The reflow profile is a straight

line representation of a nominal

temperature profile for a convec-

tive reflow solder process. The

temperature profile is divided

into four process zones, each

with different ∆T/∆time tempera-

ture change rates. The ∆T/∆time

rates are detailed in the above

table. The temperatures are

measured at the component to

printed circuit board connections.

In process zone P1, the PC board

and HSDL-3210 castellation I/O

pins are heated to a temperature

of 125°C to activate the flux in

the solder paste. The temperature

ramp up rate, R1, is limited to

4°C per second to allow for even

heating of both the PC board and

HSDL-3210 castellation I/O pins.

Process zone P2 should be of

sufficient time duration (> 60

seconds) to dry the solder paste.

The temperature is raised to a

level just below the liquidus point

of the solder, usually 170°C

(338°F).

Process zone P3 is the solder

reflow zone. In zone P3, the tem-

perature is quickly raised above

the liquidus point of solder to

230°C (446°F) for optimum

results. The dwell time above the

liquidus point of solder should be

between 15 and 90 seconds. It

usually takes about 15 seconds to

assure proper coalescing of the

solder balls into liquid solder and

the formation of good solder

connections. Beyond a dwell

time of 90 seconds, the inter-

metallic growth within the solder

connections becomes excessive,

resulting in the formation of weak

and unreliable connections. The

temperature is then rapidly

reduced to a point below the

solidus temperature of the solder,

usually 170°C (338°F), to allow

the solder within the connections

to freeze solid.

Process zone P4 is the cool down

after solder freeze. The cool

down rate, R5, from the liquidus

point of the solder to 25°C (77°F)

should not exceed –3°C per sec-

ond maximum. This limitation is

necessary to allow the PC board

and HSDL-3210 castellation I/O

pins to change dimensions

evenly, putting minimal stresses

on the HSDL-3210 transceiver.

11

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