HSP061-8M16(2010) 查看數據表（PDF） - STMicroelectronics

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HSP061-8M16
(Rev.:2010)

8-line ESD protection for high speed lines

STMicroelectronics 

Recommendation on PCB assembly

HSP061-8M16

4.3

PCB design

1. To control the solder paste amount, the closed via is recommended instead of open

vias.

2. The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

Figure 13. Printed circuit board layout recommendations

1661 15 14 13 12 11 10 9

GND

12345678

Footprint pad

PCB tracks

4.4

Note:

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

260°C max

255°C

220°C

180°C

125 °C

3°C/s max

3°C/s max

2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended

0

0

1

2

3

4

5

6

7

10-30 sec

Time (min)

90 to 150 sec

90 sec max

Minimize air convection currents in the reflow oven to avoid component movement.

8/10

Doc ID 18055 Rev 1

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