HSP061-8M16 查看數據表（PDF） - STMicroelectronics

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HSP061-8M16

8-line ESD protection for high speed lines

STMicroelectronics 

Recommendation on PCB assembly

3

Recommendation on PCB assembly

HSP061-8M16

3.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 12. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio

=

W-----

T

≥

1,5

Aspect Area = 2----T---L-(---L-×----+-W----W------) ≥ 0,66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 13. Recommended stencil window position

4 µm

4 µm

14 µm

T=100 µm

6/10

400 µm

400 µm

192 µm

14

200 µm

2800 µm

µm

60 µm

2000 µm

60 µm

400 µm

Footprint

Stencil window

Footprint

DocID18055 Rev 3

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