MCIMX355AVM4B 查看數據表（PDF） - Freescale Semiconductor

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MCIMX355AVM4B

i.MX35 Applications Processors for Automotive Products

Freescale Semiconductor 

Table 1. Ordering Information (continued)

Description

Part Number1

Silicon

Revision

Package2

Speed

Operating

Temperature

Range (°C)

Signal Ball

Map

Locations

Ball Map

i.MX356

MCIMX356AJQ4C

2.1

5284 400MHz -40 to 85

Table 92

Table 94

i.MX356

MCIMX356AJQ5C

2.1

5284 532MHz -40 to 85

Table 92

Table 94

1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers

indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:

Indicated by the Icon (!)

2 Case 5284 is RoHS-compliant, lead-free, MSL = 3, 1.

The ball map for silicon revision 2.1 is different than the ballmap for silicon revision 2.0. The layout for

each revision is not compatible, so it is important that the correct ballmap be used to implement the layout.

See Section 5, “Package Information and Pinout.”

Table 2 shows the functional differences between the different parts in the i.MX35 family.

Table 2. Functional Differences in the i.MX35 Parts

Module

I2C (3)

CSPI (2)

SSI/I2S (2)

ESAI

SPDIF I/O

USB HS Host

USB OTG

FlexCAN (2)

MLB

Ethernet

1-Wire

KPP

SDIO/MMC (2)

SDIO/Memory Stick

External Memory Controller (EMC)

JTAG

PATA

CE-ATA

MCIMX351

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

—

—

MCIMX355

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

MCIMX356

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

i.MX35 Applications Processors for Automotive Products, Rev. 6

4

Freescale Semiconductor

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