FDS6670AS 查看數據表（PDF） - Richtek Technology
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FDS6670AS Datasheet PDF : 18 Pages
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RT8298
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
GND
COUT
Q1
BG
L
VOUT CBOOT
CVCC capacitor must
SW
BOOT
2
be placed as close to
VCC
3
the IC as possible.
CVCC
BG
4
Input capacitor must be placed
as close to the IC as possible.
VIN
CIN
8
VIN
The EN/SYNC must be kept
away from noise. The trace
should be short and shielded
with a ground trace.
7
GND
6
9
5
EN/SYNC GND
FB
GND
R2
R1 VOUT
GND
The feedback components
must be connected as close
to the device as possible.
Figure 9. PCB Layout Guide for SOP-8 (Exposed Pad)
GND
R2
VOUT
R3
VCC
R1
FB 1
PGOOD 2
GND EN/SYNC 3
The EN/SYNC must be kept
away from noise. The trace
should be short and shielded
with a ground trace.
VIN
CIN
VIN 4
VIN 5
VIN 6
NC 7
The feedback components
must be connected as close
to the device as possible.
14 GND
CVCC capacitor must
be placed as close to
the IC as possible.
13 BG
12 VCC
CVCC
GND
15
11 BOOT
10 SW
9 SW
8 SW
Q1
CBOOT
L VOUT
BG
COUT
SW should be connected
to inductor by wide and
short trace. Keep sensitive
components away from
this trace.
Input capacitor must be
placed as close to the
IC as possible.
GND
Figure 10. PCB Layout Guide for WDFN-14L 4x3
Copyright ©2011 Richtek Technology Corporation. All rights reserved.
www.richtek.com
16
is a registered trademark of Richtek Technology Corporation.
DS8298-01 November 2011
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