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ISL80138IVEAJZ 查看數據表(PDF) - Renesas Electronics

零件编号
产品描述 (功能)
生产厂家
ISL80138IVEAJZ
Renesas
Renesas Electronics Renesas
ISL80138IVEAJZ Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
ISL80138
Package Outline Drawing
M14.173B
14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 1/10
A
13
5.00 ±0.10
14
8
SEE
DETAIL "X"
3.10 ±0.10
6.40
4.40 ±0.10
2
3
0.20 C B A
1
7
0.65
TOP VIEW
PIN #1
I.D. MARK
B
0.15 +0.05/-0.06
END VIEW
3.00 ±0.10
EXPOSED THERMAL PAD
BOTTOM VIEW
H
C
SEATING
PLANE
0.10 C
0.05
1.20 MAX
0.25 +0.05/-0.06 5
0.10 CBA
SIDE VIEW
(3.10)
(1.45)
(5.65)
(3.00)
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
FN7969 Rev 1.00
January 15, 2016
0.90 +0.15/-0.10
0.05 MIN
0.15 MAX
1.00 REF
DETAIL "X"
GAUGE
PLANE
0.25
0°-8°
0.60 ±0.15
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion.
Allowable protrusion shall be 0.80mm total in excess of dimension at
maximum material condition.
Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation ABT-1.
Page 9 of 9

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