ISL80083 查看數據表（PDF） - Intersil
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ISL80083 Datasheet PDF : 21 Pages
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ISL80083
Pin Descriptions (Continued)
PIN NUMBER
C4
C5
D1
D2
D3
D4
D5
E1
E2
E3
E4
E5
PIN NAME
DESCRIPTION
GNDLDO Power ground for LDO.
GND
System ground for analog and digital circuitry.
VIN_REMOTE Input voltage secondary for cases where VIN_HOST is valid, VIN_REMOTE is held off IC. If there is 2.6V present and VIN host
is not valid, then the pass MOSFET turns on. If this voltage is greater than 4.5V, then its pass MOSFET turn off.
OSC_EN
SCLK
SDAT
Oscillator control pin. Connect to logic high will allow all outputs to operate normally and SMPS in PWM. Connecting
to logic low will disable the 33MHz oscillator, 1VAUX, and allow the SMPS to operate in high light load efficiency PFM.
There is a 125kΩ pull-up resistor from this pin to 1.8V.
I2C interface clock pin.
I2C interface data pin.
1VAUX
This rail is a low impedance pass PFET switch sourcing from switcher’s output thru the VFB pin.
VIN_HOST Input voltage primary for the IC. If there is 2.6V present, then the pass MOSFET turns on. If this voltage is greater than 4.5V,
then its pass MOSFET turn off.
VSELECT
Input voltage for buck converter switcher, V3CLAMP, LDO, and it also serves as the power supply pin for the whole internal
digital/analog circuits.
PHASE Switching node for DC to DC converter; connect to one terminal of the inductor.
PGND
Power ground for switcher.
FB
Feedback pin for switcher; connect external voltage divider resistors between switcher output, this pin and ground. For
fixed output versions, connect this pin directly to the switcher output.
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
SLV
FB
LDO
(V)
(V)
TEMP. RANGE
(°C)
PACKAGE
Tape & Reel
(Pb-free)
PKG.
DWG. #
ISL80083IIZ-T
80083
Adj
3.3
-40 to +85
25 Ball WLCSP
W5x5.25B
ISL80083IIZ-TK
80083
Adj
3.3
-40 to +85
25 Ball WLCSP
W5x5.25B
ISL80083IIZ-TS
80083
Adj
3.3
-40 to +85
25 Ball WLCSP
W5x5.25B
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material sets; molding compounds/die attach materials and
SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free
WLCSP and BGA packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL80083. For more information on MSL please see Tech Brief TB363.
3
FN7886.1
May 15, 2013
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