ISL97673IRZ-TK 查看數據表（PDF） - Intersil

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ISL97673IRZ-TK

6-Channel SMBus or PWM Dimming LED Driver with Phase Shift Control

Intersil 

ISL97673

Absolute Maximum Ratings (TA = +25°C)

VIN, EN/PWM. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V

FAULT . . . . . . . . . . . . . . . . . . . . . VIN - 8.5V to VIN + 0.3V

VDC, COMP, RSET, FPWM, OVP . . . . . . . . . . . . -0.3V to 5.5V

SMBCLK(SCL), SMBDAT(SDA) . . . . . . . . . . . . -0.3V to 5.5V

CH0 - CH5, LX . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V

PGND, AGND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V

Above voltage ratings are all with respect to AGND pin

ESD Rating

Human Body Model (Tested per JESD22-A114E) . . . . . 3kV

Machine Model (Tested per JESD22-A115-A) . . . . . . . 300V

Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 1kV

Thermal Information

Thermal Resistance (Typical)

θJA (°C/W) θJC (°C/W)

20 Ld QFN Package (Notes 4, 5, 7) .

40

2.5

Thermal Characterization (Typical)

PSIJT (°C/W)

20 Ld QFN Package (Note 6) . . . . . . . . . . . . 1

Maximum Continuous Junction Temperature . . . . . . +125°C

Storage Temperature . . . . . . . . . . . . . . . -65°C to +150°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C

IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless

otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact

product reliability and result in failures not covered by warranty.

NOTES:

4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”

features. See Tech Brief TB379.

5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

6. PSIJT is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this

rating then the die junction temperature can be estimated more accurately than the θJC and θJC thermal resistance ratings

7. Refer to JESD51-7 high effective thermal conductivity board layout for proper via and plane designs.

Electrical Specifications

All specifications below are tested at TA = +25°C; VIN = 12V, EN/PWM = 5V, RSET = 20.1kΩ,

unless otherwise noted. Boldface limits apply over the operating temperature range,

-40°C to +85°C.

PARAMETER

DESCRIPTION

CONDITION

MIN

MAX

(Note 8) TYP (Note 8) UNIT

GENERAL

VIN (Note 9) Backlight Supply Voltage

≤11 LEDs per channel

4.5

(3.2V/20mA type)

26.5

V

IVIN_STBY

VOUT

VIN Shutdown Current

Output Voltage

VUVLO

VUVLO_HYS

REGULATOR

Undervoltage Lock-out Threshold

Undervoltage Lock-out Hysteresis

4.5V < VIN ≤ 26V,

FSW = 600kHz

8.55V < VIN ≤ 26V,

FSW = 1.2MHz

4.5V < VIN ≤ 8.55V,

FSW = 1.2MHz

10

µA

45

V

45

V

VIN/0.19 V

2.6

3.3

V

275

mV

VDC

IVDC_STBY

IVDC

VLDO

ENLow

ENHi

tENLow

LDO Output Voltage

Standby Current

Active Current

VDC LDO Droop Voltage

Guaranteed Range for EN Input Low Voltage

Guaranteed Range for EN Input High Voltage

EN/PWMI Low Time Before Shut-down

VIN > 6V

EN/PWMI = 0V

EN/PWMI = 5V

VIN > 5.5V, 20mA

4.55

4.8

5

V

5

µA

5

mA

20

200

mV

0.5

V

1.8

V

30.5

ms

5

FN7633.0

June 24, 2010

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