KTY81-2 查看數據表（PDF） - Philips Electronics

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产品描述 (功能)

生产厂家

KTY81-2

Silicon temperature sensors

Philips Electronics 

Philips Semiconductors

Silicon temperature sensors

Product specification

KTY81-2 series

PACKAGING

Sensors in SOD70 encapsulation are delivered in bulk packaging, and also reel packaging for automatic placement on

hybrid circuits and printed-circuit boards (see Figs 7 and 8).

Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres. The lead-to-lead distance of types

packaged on reel is 5.08 millimetres for spread lead types and 2.54 millimetres for straight lead types.

handbook, full pagewidth

H1

H0

L

P

A1

A

H2

T

(p)

∆h

∆h

W2

W0 W1

W

F1

F2

D0

F

P2

P0

MBH795

t1

t

Fig.7 Configuration of bandolier: spread leads.

2000 Aug 25

10

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