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KTY82-1 查看數據表(PDF) - Philips Electronics

零件编号
产品描述 (功能)
生产厂家
KTY82-1
Philips
Philips Electronics Philips
KTY82-1 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
Silicon temperature sensors
Product specification
KTY82-1 series
PACKAGING
Tape specification
Sensors in SOT23 encapsulation are delivered in reel packaging for automatic placement on hybrid circuits and
printed-circuit boards. The devices are placed with the mounting side downwards in the compartments.
handbook, full pagewidth
component 0.2
1.5
0.1
0
4.0 0.1
2.0 0.1
4.0 0.1(1)
direction of unreeling
0.75
min
5.5
0.25
8
3.5
0.2
0.05
1.75
0.1
1.5
max
,,,, 3.3 1.0
max min
,,,,,,,,,,0.4
max
MBB570 - 2
Dimension in mm.
(1) Tolerance over any 10 pitches: ±0.2 mm.
Fig.7 Configuration of bandolier.
1998 Mar 26
10

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