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L6374 查看數據表(PDF) - STMicroelectronics

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L6374
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L6374 Datasheet PDF : 19 Pages
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Thermal characteristics
4
Thermal characteristics
L6374
4.1
4.2
4.3
Table 4. Thermal data
Symbol
Parameter
RthJP
RthJA1
RthJA2
Thermal resistance, junction to pin
Thermal resistance, junction to ambient
(see thermal characteristics)
Thermal resistance, junction to ambient
(see thermal characteristics)
Value
17
65
80
Unit
°C/W
°C/W
°C/W
RthJP
The reference point is the knee on the four central pins, where the pins are upwardly bent
and the soldering joint with the PCB footprint can be made.
RthJA1
If a dissipating surface, thick at least 35 µm, and with a surface similar or bigger than the
one shown, is created making use of the printed circuit. Such heatsinking surface is
considered on the bottom side of an horizontal PCB (worst case).
RthJA2
If the power dissipating pins (the four central ones), as well as the others, have a minimum
thermal connection with the external world (very thin strips only) so that the dissipation
takes place through still air and through the PCB itself.
It is the same situation of point above, without any heatsinking surface created on purpose
on the board.
6/19

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