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LM2901YD 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
LM2901YD
ST-Microelectronics
STMicroelectronics ST-Microelectronics
LM2901YD Datasheet PDF : 13 Pages
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LM2901
5
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
5.1
DIP14 package information
Figure 21. DIP14 package mechanical drawing
Table 4.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
DIP14 package mechanical data
Dimensions
Millimeters
Min.
0.51
1.39
1.27
Typ.
0.5
0.25
8.5
2.54
15.24
3.3
Max.
1.65
20
7.1
5.1
2.54
Min.
0.020
0.055
0.050
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
0.130
Max.
0.065
0.787
0.280
0.201
0.100
9/13

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