DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

LPC4045ATED100K 查看數據表(PDF) - KOA Speer Electronics, Inc.

零件编号
产品描述 (功能)
生产厂家
LPC4045ATED100K
KOA
KOA Speer Electronics, Inc. KOA
LPC4045ATED100K Datasheet PDF : 4 Pages
1 2 3 4
KOA SPEER ELECTRONICS, INC.
7. General Information
7.1 Storage
Chip inductors shall not be stored under high
temperature and high humidity conditions.
Especially, do not store taping where they are
exposed to heat or direct sunlight. Otherwise,
material may be deformed, causing problems
during mounting.
7.2 Mounting
Placement force should not be excessive.
7.3 Soldering
Soldering should be done at 250°C for less
than 6 seconds. When using a soldering iron,
temperature shall not exceed 350°C and
within 3 seconds. Soldering iron time shall
be allowed only one time. After soldering, chip
inductors shall not be stressed excessively.
SS-194 R5
7.4 Cleaning
There is no problem using organic solvents.
Since these chip inductors are a coil of
ultra-thin wire, they are susceptible to
vibration. If an ultrasonic cleaning unit is
used, check for any possibility of problem
generation before practical use, since such
cleaning units differ considerably in vibration
level and mode. Although the conditions
vary depending on the printed board size,
Ultrasonic cleaning is generally used in
the conditions described in the following
examples:
Power: Within 20W/L
Cleaning times: Within 5 minutes
7.5 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must
be separated by means of solder resists
to prevent excessive solder.
8. Soldering
8.1 Conditions for Reflow Soldering
The time and temperature for reflow solder
applications are as shown below.
230
200
160
Time
Within 90
seconds
Within 45
seconds
Within 30
seconds
Within 6
seconds
9. Land Pattern Design
9.1 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must be
separated by means of solder resists to
prevent excessive solder.
(unit: mm)
1.8 1.5 1.8
3.5
Clean solder film 300
± 100 micron
PAGE 4 OF 4
Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]