LT3476EUHF(RevA) 查看數據表（PDF） - Linear Technology
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LT3476EUHF Datasheet PDF : 12 Pages
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LT3476
TYPICAL APPLICATIO
PVIN
5V TO 25V
350mA
5V to 25V Step-Up/Step-Down Driver for 2 Series 350mA LEDs
350mA
350mA
350mA
LED1
300mΩ
10μH
LED2
300mΩ
10μH 10μH
LED3
300mΩ
10μH
LED4
300mΩ
CAP1
2.2μF
CAP2
2.2μF
2.2μF
CAP3
2.2μF
CAP4
VIN
2.8V TO
16V
PWM1-4
SHDN
2.2μF
SW1
CAP1-4
LED1-4
VIN
PWM1-4
SHDN
SW2 SW3
LT3476
GND
SW4
REF
VADJ1-4
VC1-4
RT
3476 TA03
1.05V
47k
47nF
PACKAGE DESCRIPTIO
0.70
± 0.05
5.50
± 0.05
(2 SIDES)
4.10
± 0.05
(2 SIDES)
3.15
± 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
5.15 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.75 ± 0.05
0.00
– 0.05
7.00
± 0.10
(2 SIDES)
5.15
± 0.10
(2 SIDES)
3.15 ± 0.10
(2 SIDES)
37 38
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
0.40
±0.10
1
2
0.75
± 0.05
0.200 REF
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
0.40
±0.10
(UH) QFN 0205
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3476fa
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