LTC1522CMS8 查看數據表（PDF） - Linear Technology
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LTC1522CMS8 Datasheet PDF : 8 Pages
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LTC1522
APPLICATIONS INFORMATION
General Layout Considerations
Due to the high switching frequency and high transient
currents produced by the LTC1522, careful board layout
is a must. A clean board layout using a ground plane and
short connections to all capacitors will improve perfor-
mance and ensure proper regulation under all conditions
(refer to Figure 4).
CIN
VIN
VOUT
COUT
1
2
LTC1522
3
4
8
7 SHDN
6
GND
5
CFLY
1522 F04
Figure 4. Suggested Component Placement for LTC1522
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
MS8 Package
8-Lead Plastic MSOP
(LTC DWG # 05-08-1660)
0.118 ± 0.004*
(3.00 ± 0.102)
0.007
(0.18)
0° – 6° TYP
0.040 ± 0.006
(1.02 ± 0.15)
0.021 ± 0.006
(0.53 ± 0.015)
SEATING
PLANE
0.012
(0.30)
REF
0.0256
(0.65)
TYP
0.034 ± 0.004
(0.86 ± 0.102)
0.006 ± 0.004
(0.15 ± 0.102)
0.192 ± 0.004
(4.88 ± 0.10)
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
8 76 5
0.118 ± 0.004**
(3.00 ± 0.102)
MSOP (MS8) 1197
1 234
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
0.010
(0.254
–
–
0.020
0.508)
×
45°
0.008 – 0.010
(0.203 – 0.254)
0.053 – 0.069
(1.346 – 1.752)
0°– 8° TYP
0.016 – 0.050
0.406 – 1.270
0.014 – 0.019
(0.355 – 0.483)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
TYP
0.228 – 0.244
(5.791 – 6.197)
0.189 – 0.197*
(4.801 – 5.004)
8
7
6
5
1
2
34
0.150 – 0.157**
(3.810 – 3.988)
SO8 0996
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
7
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