LTC1700EMS 查看數據表（PDF） - Linear Technology
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LTC1700EMS Datasheet PDF : 16 Pages
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TYPICAL APPLICATIO
LTC1700
LTC1700 3.3V/1A Regulator with External Frequency Synchronization
L1
1.5µH
C2 +
10µF
100pF
1
SGND
10
SW
180pF
2.2k
470pF
30k
LTC1700
2
ITH
4
RUN/SS
8
BG
9
PGND
3
VFB
6
TG
53.6k
5
7
SYNC/MODE VOUT
650kHz
M1
M1
C4 +
22µF
C1: AVX TAJB686K006R
C2: TAIYO YUDEN CERAMIC JMK316BJ106ML
C3: AVX TPSD227M006R0100
C4: TAIYO YUDEN CERAMIC JMK325BJ226MM
L1: MURATA LQN6C
M1: SILICONIX Si6562DQ
C1
68µF
6.3V
VIN
2V TO 2.4V
3.3V/1A
C3
220µF
6.3V
1700 • TA01
PACKAGE DESCRIPTIO
0.889 ± 0.127
(.035 ± .005)
MS Package
10-Lead Plastic MSOP
(LTC DWG # 05-08-1661)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
12345
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
0.86
(.034)
REF
SEATING
PLANE 0.17 – 0.27
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.007 – .011)
TYP
0.50
(.0197)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.127 ± 0.076
(.005 ± .003)
MSOP (MS) 0603
1700fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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