LTC2054IS5(RevA) 查看數據表（PDF） - Linear Technology
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LTC2054IS5 Datasheet PDF : 12 Pages
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LTC2054/LTC2055
PACKAGE DESCRIPTIO
0.675 ±0.05
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
PIN 1
OUTLINE TOP MARK
(NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.889 ± 0.127
(.035 ± .005)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE
OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM
OF PACKAGE DO NOT INCLUDE MOLD FLASH.
MOLD FLASH, IF PRESENT, SHALL NOT EXCEED
0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1
LOCATION ON TOP AND BOTTOM OF PACKAGE
(DD8) DFN 1203
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.18
(.007)
0.62
0.95
MAX
REF
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
2.80 – 3.10
(NOTE 4)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.86
(.034)
REF
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS
SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.102mm (.004") MAX
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0603
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.60 – 3.00
1.50 – 1.75
(NOTE 4)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
0.09 – 0.20
(NOTE 3)
DATUM ‘A’
PIN ONE
0.95 BSC
0.90 – 1.30
0.90 – 1.45
0.25 – 0.50
TYP 5 PLCS
NOTE 3
0.00 – 0.15
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD
FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. PACKAGE EIAJ REFERENCE IS SC-74A (EIAJ)
ATTENTION: ORIGINAL SOT23-5L PACKAGE.
MOST SOT23-5L PRODUCTS CONVERTED TO THIN SOT23
PACKAGE, DRAWING # 05-08-1635 AFTER APPROXIMATELY
APRIL 2001 SHIP DATE
0.35 – 0.55 REF
1.90 BSC
S5 SOT-23 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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