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LTC2054MPS5-PBF 查看數據表(PDF) - Linear Technology

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LTC2054MPS5-PBF Datasheet PDF : 16 Pages
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LTC2054/LTC2055
ELECTRICAL CHARACTERISTICS (LTC2054HVMP) The denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. VS = ±5V unless otherwise noted. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN TYP MAX
UNITS
IS
VOS
ΔVOS/ΔT
Supply Current
Input Offset Voltage
Average Input Offset Drift
Long-Term Offset Drift
No Load
(Note 3)
(Note 3)
175 220
μA
± 10
μV
0.05 ± 0.1
μV/°C
50
nV/√mo
IB
Input Bias Current
(Note 4)
±3
pA
± 12
nA
IOS
Input Offset Current
(Note 4)
±6
pA
±5
nA
en
CMRR
Input Noise Voltage
Common Mode Rejection Ratio
RS = 100Ω, DC to 1Hz
RS = 100Ω, DC to 10Hz
VCM = GND to V+ – 0.9
0.6
1.6
120 130
110
μVP-P
μVP-P
dB
dB
PSRR
Power Supply Rejection Ratio
VS = 2.7V to 11V
120 130
dB
110
dB
AVOL
Large-Signal Voltage Gain
RL = 100k, VOUT = GND
125 140
dB
115
dB
VOUT
Maximum Output Voltage Swing
SR
Slew Rate
RL = 5k to GND
RL = 5k to GND
RL = 100k to GND
RL = 100k to GND
±4.78 ±4.82
V
±4.675
V
±4.98 ±4.99
V
±4.965
V
0.5
V/μs
GBW
Gain Bandwidth Product
500
kHz
fS
Internal Sampling Frequency
1
kHz
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC2054/LTC2055 are designed, characterized and expected to
meet the extended temperature limits of –40°C and 125°C. The LTC2054C/
LTC2055C/LTC2054HVC/LTC2055HVC are guaranteed to meet the
temperature limits of 0°C and 70°C. The LTC2054I/LTC2055I/LTC2054HVI/
LTC2055HVI are guaranteed to meet temperature limits of –40°C and
85°C. The LTC2054H/LTC2055H and LTC2054HVH/LTC2055HVH are
guaranteed to meet the temperature limits of –40°C and 125°C. The
LTC2054MP/LTC2054HVMP are guaranteed to meet the temperature limits
of –55°C and 150°C.
Note 3: These parameters are guaranteed by design. Thermocouple effects
preclude measurements of these voltage levels during automated testing.
Note 4: Limit is determined by high speed automated test capability. See
Typical Characteristic curves for actual typical performance. For tighter
specifications, please consult Linear Technology Marketing.
Note 5: The θJA specified for the DD package is with minimal PCB heat
spreading metal. Using expanded metal area on all layers of a board
reduces this value.
20545fc
6

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