LTC3212EDDB 查看數據表（PDF） - Linear Technology

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LTC3212EDDB

RGB LED Driver and Charge Pump

Linear Technology 

LTC3212

Pin Functions

CP, CM (Pins 1, 11): Charge Pump Flying Capacitor Pins.

A 1µF X5R or X7R ceramic capacitor should be connected

from CP to CM.

CPO (Pin 2): CPO is the output of the charge pump. A 1µF

X5R or X7R ceramic capacitor is required from CPO to

GND. While operating, this pin will supply current to the

LEDs and while in shutdown mode this pin will be high

impedance.

LEDEN (Pin 3): The LEDEN pin is used to program, enable

and shut down the part. A 3µA internal current source

pulls this pin to ground.

ISETB, ISETR, ISETG (Pins 4, 5, 6): LED current program-

ming resistor pins. A resistor connected between a pin

and GND is used to set the LED current. A resistor from

ISETG to GND is required. Resistors on ISETR and ISETB

are optional. If ISETR and/or ISETB is not connected to a

resistor ISETR’s and/or ISETB’s respective output(s) will be

automatically programmed by the resistor connected to

ISETG. If ISETR or ISETB is unused the pin should be con-

nected to VIN.

LEDG, LEDR, LEDB (Pins 7, 8, 9): These pins are

the LED current output pins. The LEDs are connected

from either the charge pump or VIN (anode) to LED

(R, G, B) (cathode).

GND (Pin 10): This pin should be connected directly to a

low impedance ground plane.

VIN (Pin 12): Supply voltage for the LTC3212. VIN should

be bypassed with a low impedance ceramic capacitor to

GND of at least 1µF of capacitance.

Exposed Pad (Pin 13): GND. The Exposed Pad must be

soldered to a low impedance ground plane for optimum

performance.

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