LTC3218EDDB 查看數據表（PDF） - Linear Technology

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LTC3218EDDB

400mA Single Wire Camera LED Charge Pump

Linear Technology 

LTC3218

APPLICATIONS INFORMATION

At moderate to high output power, the quiescent current

of the LTC3218 is negligible and the expression above is

valid.

Once dropout is detected at the ILED pin, the LTC3218

enables the charge pump in 2x mode.

In 2x boost mode, the efficiency is similar to that of a

linear regulator with an effective input voltage of 2 times

the actual input voltage. In an ideal 2x charge pump, the

power efficiency would be given by:

ηID E A L

≡

PL E D

PIN

=

VLED • ILED

VIN • 2 • ILED

≈

VL E D

2VIN

Thermal Management

For higher input voltages and maximum output current,

there can be substantial power dissipation in the LTC3218.

If the junction temperature increases above approximately

165°C, the thermal shutdown circuitry will automatically

deactivate the output. To reduce maximum junction tem-

perature, a good thermal connection to the PC board is

recommended. Connecting the Exposed Pad to a ground

plane and maintaining a solid ground plane under the

device can reduce the thermal resistance of the package

and PC board considerably.

PACKAGE DESCRIPTION

DDB Package

10-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1722 Rev Ø)

0.64 ±0.05

(2 SIDES)

2.55 ±0.05

1.15 ±0.05

0.70 ±0.05

0.25 ± 0.05

0.50 BSC

2.39 ±0.05

(2 SIDES)

PACKAGE

OUTLINE

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

3.00 ±0.10

(2 SIDES)

R = 0.05

TYP

R = 0.115

TYP

6

0.40 ± 0.10

10

2.00 ±0.10

(2 SIDES)

0.75 ±0.05

0.64 ± 0.05

(2 SIDES)

5

0.25 ± 0.05

PIN 1

R = 0.20 OR

0.25 × 45°

CHAMFER

1

(DDB10) DFN 0905 REV Ø

0.50 BSC

0 – 0.05

2.39 ±0.05

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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