LTC3261(2012) 查看數據表（PDF） - Linear Technology
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LTC3261 Datasheet PDF : 12 Pages
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LTC3261
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = EN = 12V, MODE = 0V, RT = 200kΩ.
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Charge Pump
VIN
VUVLO
IVIN
Input Voltage Range
VIN Undervoltage Lockout Threshold
VIN Quiescent Current
VRT
RT Regulation Voltage
VOUT
VOUT Regulation Voltage
fOSC
ROUT
ISHORT_CKT
VMODE(H)
VMODE(L)
IMODE
VEN(H)
VEN(L)
Oscillator Frequency
Charge Pump Output Impedance
Max IVOUT Short-Circuit Current
MODE Threshold Rising
MODE Threshold Falling
MODE Pin Internal Pull-Down Current
EN Threshold Rising
EN Threshold Falling
VIN Rising
VIN Falling
Shutdown, = EN = 0V
MODE = VIN, IVOUT = 0mA
MODE = 0V, IVOUT = 0mA
MODE = 12V
MODE = 0V
RT = GND
MODE = 0V, RT = GND
VOUT = GND, RT = GND
VIN = MODE = 32V
l 4.5
32
V
l
3.8
4
V
l 3.4
3.6
V
2
5
μA
60
120
μA
3.5
5.5
mA
1.200
V
–0.94 • VIN
V
–VIN
V
450
500
550
KHz
32
Ω
l 100
160
250
mA
l
1.1
2
V
l 0.4
1.0
V
0.7
μA
l
1.1
2
V
l 0.4
1.0
V
IEN
EN Pin Internal Pull-Down Current
VIN = EN = 32V
0.7
μA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3261 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3261E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3261I is guaranteed over the –40°C to 125°C operating junction
temperature range. High junction temperatures degrade operating
lifetimes; operating lifetime is derated for junction temperatures greater
than 125°C. Note that the maximum ambient temperature consistent with
these specifications is determined by specific operating conditions in
conjunction with board layout, the rated package thermal impedance and
other environmental factors.
The junction temperature (TJ, in °C) is calculated from the ambient
temperature (TA, in °C) and power dissipation (PD, in Watts) according to
the formula:
TJ = TA + (PD • θJA),
where θJA = 40°C/W is the package thermal impedance.
Note 3: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperatures will exceed 150°C when overtemperature protection is
active. Continuous operation above the specified maximum operating
junction temperature may result in device degradation or failure.
3261f
3
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