LTC6915IDE 查看數據表（PDF） - Linear Technology
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LTC6915IDE
Linear Technology
LTC6915IDE Datasheet PDF : 18 Pages
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LTC6915
Typical Application
Multiplexing Two LTC6915’s
Send a gain code of 0000 to one IC to set its output to a
high impedance state and send a gain code other than 0000
to the second IC to set it for normal amplification. If both
devices are ON, the 200Ω resistors protect the outputs.
The sense pin connection maintains gain accuracy for
loads 1k or greater.
5V
0.1µF
VIN1
–5V
0.1µF
P
(TTL
LEVELS)
DATA
SELECT
CLOCK
SHDN
V+
LTC6915
IN– #1 OUT
IN+
SENSE
200Ω
5V
0.1µF
VIN2
V–
REF
HOLD_THRU NC
–5V
0.1µF
CS
PAR_SER –5V
DIN
DGND
CLK
DOUT
SHDN
V+
LTC6915
200Ω
IN– #2 OUT
IN+
SENSE
V–
REF
HOLD_THRU NC
CS
PAR_SER –5V
DIN
DGND
CLK
DOUT
VOUT
6915 F06
Figure 6. A 2:1 Multiplexing Two LTC6915’s
with Daisy Chained Gain Control
Package Description
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
0.70 ±0.05
4.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
7
TYP
0.40 ± 0.10
12
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ± 0.05
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
0.25 ± 0.05
0.50 BSC
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.200 REF
3.00 ±0.10
(2 SIDES)
3.30 ±0.10
1.70 ± 0.10
0.75 ±0.05
0.00 – 0.05
6
0.25 ± 0.05
1
0.50 BSC
2.50 REF
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
.045 ±.005
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.254 MIN
.150 – .165
.0165 ±.0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
16
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
6915fb
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