LTM4600HVIV(RevE) 查看數據表（PDF） - Linear Technology

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LTM4600HVIV
(Rev.:RevE)

10A, 28VIN High Efficiency DC/DC µModule

Linear Technology 

LTM4600HV

Absolute Maximum Ratings Pin Configuration

(Note 1)

FCB, EXTVCC, PGOOD, RUN/SS, VOUT.......... –0.3V to 6V

VIN, SVIN, fADJ............................................. –0.3V to 28V

VOSET, COMP............................................. –0.3V to 2.7V

Operating Temperature Range (Note 2)

E and I Grades......................................–40°C to 85°C

MP Grade............................................ –55°C to 125°C

Junction Temperature............................................ 125°C

Storage Temperature Range................... –55°C to 125°C

Peak Solder Reflow Body Temperature.................. 245°C

VIN

PGND

TOP VIEW

COMP

SGND

RUN/SS

FCB

PGOOD

VOUT

LGA PACKAGE

104-LEAD (15mm × 15mm × 2.82mm)

TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W,

θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS, WEIGHT = 1.7g

Order Information

PART NUMBER

PAD OR BALL FINISH

PART MARKING

DEVICE

FINISH CODE

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

LTM4600HVEV#PBF

LTM4600HVEV

–40°C to 85°C

LTM4600HVIV#PBF

Au (RoHS)

LTM4600HVIV

e4

LGA

3

–40°C to 85°C

LTM4600HVMPV#PBF

LTM4600HVMPV

–55°C to 125°C

• Consult Marketing for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures: www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings: www.linear.com/packaging

4600hvfe

2

For more information www.linear.com/LTM4600HV

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